Advanced packaging is now an integral part of the enhanced functionality in various electronic devices, such as smart phones and autonomous machines, contributing to the device’s high density in small footprints. Growing penetration of the artificial intelligence is contributing to the growth of the advanced packaging market growth. The chipsets used for AI applications need high processing cores along with efficiency, which increases market opportunities. The growing development of automotive electronics and advanced vehicle management systems will contribute to the revenue of the advanced packaging market. The automotive industry is considering the adoption of advanced packaging chipsets that are integrated in ADAS, electric vehicles (EV) and other applications. The companies are focused on developing automotive solutions using advanced packaging technology, which is set create great opportunities for the market players in the coming period.
SkyWater Technology, the only foundry subsidiary owned and operating in the U.S., has made an alliance with Osceola County, Florida, and BRIDG, to stimulate the development and production of advanced microelectronic packaging. SkyWater Florida will control the operation of the NeoVation Center and partner with BRIDG, a nonprofit organization dedicated to advanced research, development and production of next generation microelectronics.
The global advanced packaging market is generally bifurcated based on type, industry vertical, and regions. By type, the global advanced packaging market is diversified into fan out silicon in package, 3D integrated circuit integrated circuit, wafer level chip scale package, 2D integrated circuit, fan out wafer level package, 2.5D integrated circuit, and flip chip. Further based on industry vertical, the global market is broadly segmented into industrial, IT & telecommunication, aerospace & defense, healthcare, automotive & transport, consumer electronics, and others.
Region-wise, Asia Pacific is set to dominate the global advanced packaging market owing to increased customer demand for electronics and presence of some of the leading manufacturers in the region. North America and European regions are estimated to make significant growth owing to high number of innovation in electronic products and gadgets.
The key competitors in the global advanced packaging market include Amkor Technology, International Business Machines Corporation (IBM), Precision Industries Co., ASE Group, STATS ChipPAC Pte. Ltd., Ltd., Qualcomm Technologies, Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Siliconware, SSS MicroTec AG., Taiwan Semiconductor Manufacturing Company, and Intel Corporation. Key players are constantly investing to leverage smart devices and high computing products developments such as supercomputer applications, cloud computing, and data center, among others.